DocumentCode :
1584179
Title :
A New Nano-Probe Using Micro Assembly Transfer
Author :
Chen, Jen-Yi ; Lin, Chun-Te ; Liao, Wei-Chuan ; Hui Chi Su ; Tsai, Ching-Hsiang ; Chiang, Kuo-Ning
Author_Institution :
Microsystems Technol. Center, Ind. Technol. Res. Inst., Tainan
fYear :
2006
Firstpage :
1
Lastpage :
4
Abstract :
This paper demonstrates a new force sensing nano-probe that allows a cost effective nano-tip to be easily assembly on a tuning fork sensor. By taking advantages of surface micromachined tip fabrication, the subsequent assembly-transfer procedures are able to minimize the mass load effect of a tuning fork based atomic force microscopy (AFM). Furthermore, the micro assembly transfer of nano-probes can also be achieved to manufacture devices in an easy way and to mount the probe precisely. This approach is compatible with CMOS process and able to integrate micromachined probes into an alternative host chip
Keywords :
CMOS integrated circuits; atomic force microscopy; force sensors; microassembling; micromachining; microsensors; nanotechnology; AFM; CMOS process; assembly-transfer procedures; atomic force microscopy; force sensing nano-probe; manufacture devices; micro assembly transfer; micromachined probes; surface micromachined tip fabrication; tuning fork sensor; Assembly; Atomic force microscopy; Atomic measurements; Costs; Fabrication; Force sensors; Manufacturing; Nanoscale devices; Probes; Vibrations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International
Conference_Location :
Taipei
Print_ISBN :
1-4244-0735-4
Electronic_ISBN :
1-4244-0735-4
Type :
conf
DOI :
10.1109/IMPACT.2006.312211
Filename :
4107468
Link To Document :
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