• DocumentCode
    1589321
  • Title

    Dual OS Support Peripheral Device Encapsulation

  • Author

    Qingsong, Shi ; Degui, Feng ; Ma, Jijun ; Zhang, Nan ; Chen, Tianzhou

  • Author_Institution
    Coll. of Comput. Sci., Zhejiang Univ., Hangzhou
  • fYear
    2008
  • Firstpage
    67
  • Lastpage
    72
  • Abstract
    The need of extensive computing capacity is expanding all the time. Especially in company providing network service, adding servers physically requires much more cost. Also in embedded system, resource is also very limited. That is why virtulization is so popular in research and industry application. A lot of virtulization technique is raised to supply great computing capacity with multiple operating system running synchronously in a single real machine. Of all the aspects affecting real time performance of a computer, I/O processing has played a major role. Because I/O bound process has to wait for device to be free and thus increase response time which may delay them go beyond deadline. The system-on-a-chip technology provides the scratch-pad memory(SPM), which is small, isolated and located on chip. We implement a little operating system running in SPM (SPMOS). The SPMOS provide virtual I/O interface for general operating system. Different I/O requestis buffered and scheduled if necessary. Also, with proper memory checking mechanism, we could prevent malicious attacks on SPM, which means that any program running in the SPM could be protected effectively. Experiment shows that the SPMOS based virtual I/O interface is efficient and practical.
  • Keywords
    operating systems (computers); peripheral interfaces; system-on-chip; virtual machines; dual OS support peripheral device encapsulation; memory checking mechanism; scratch-pad memory; system-on-a-chip technology; virtual I/O interface; Costs; Delay effects; Embedded system; Encapsulation; Industry applications; Isolation technology; Network servers; Operating systems; Scanning probe microscopy; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Embedded Computing, 2008. SEC '08. Fifth IEEE International Symposium on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-0-7695-3348-3
  • Type

    conf

  • DOI
    10.1109/SEC.2008.31
  • Filename
    4690726