A silicon wafer dissolved vibrating gyroscope

Since micromachining technology has raised the prospect of batch fabrication high performance sensors with low cost and small size, many researchers have investigated the micromachined gyroscope which is expected to rapidly grow in the automotive and consumer market. This paper proposes a vibrating wheel gyroscope developed by a bulk silicon dissolved wafer process. The dimension of movable elements is designed as φ 1.2 mm×0.015 mm and the FEM simulation results are provided. The fabrication sequence is introduced and the key technique of high aspect ratio trenches etching is introduced. Primary test results show that this kind of micromachined gyroscope would satisfy the requirements of trade market