• DocumentCode
    158996
  • Title

    Failure analysis of CuCr contacts of Vacuum interrupter

  • Author

    Zinzuwadia, M. ; Maiti, Kuntal ; Kulkarni, Santosh ; Nemade, J. ; Aiyer, Hemanth ; Rayudu, Srinivas

  • Author_Institution
    Global R& D Centre, Crompton Greaves Ltd., Mumbai, India
  • fYear
    2014
  • fDate
    Sept. 28 2014-Oct. 3 2014
  • Firstpage
    745
  • Lastpage
    747
  • Abstract
    The Copper-Chromium (CuCr) contact material is the most widely used material for the contacts of the vacuum interrupters (VI). Performance of the VI is greatly influenced by the properties of contact materials. During switching operations, such as short-circuit current interruption, a vacuum arc is generated which in turn produces melted and resolidified layers at the contact surface. Melting followed by welding of CuCr contact results the failure of Vacuum interrupter. This paper correlated the switching performance and the metallurgy of the contacts, specifically in cases where the contacts have welded. The paper reports important factors like microstructure, Cr distribution, conductivity, hardness etc. which significantly affect the welding performance of the contacts. The conductivity and hardness of the contacts were measured by using an eddy current based conductivity meter and Vickers hardness tester respectively. The failure of contacts because of welding has been discussed with respect to conductivity and distribution of Cr as seen in its microstructure. The contacts were also characterized by X-ray diffraction and scanning electron microscopy to correlate the data.
  • Keywords
    eddy currents; electrical contacts; failure analysis; vacuum interrupters; CuCr; Vickers hardness tester; X-ray diffraction; copper-chromium contact material; eddy current based conductivity meter; failure analysis; scanning electron microscopy; short-circuit current interruption; vacuum arc; vacuum interrupter; Conductivity; Contacts; Interrupters; Materials; Microstructure; Shape; Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
  • Conference_Location
    Mumbai
  • Print_ISBN
    978-1-4799-6750-6
  • Type

    conf

  • DOI
    10.1109/DEIV.2014.6961790
  • Filename
    6961790