DocumentCode
15927
Title
A Quality Metric for Defect Inspection Recipes
Author
Buengener, R. ; Lee, J.L. ; Trapp, B.M. ; Rudy, J.A.
Author_Institution
GLOBALFOUNDRIES, Hopewell Junction, NY, USA
Volume
26
Issue
1
fYear
2013
fDate
Feb. 2013
Firstpage
3
Lastpage
10
Abstract
This paper describes a metric that measures the quality of defect inspection recipes. It takes into account several factors including nonvisual rate, defect of interest rate, defect count per wafer, and inspection time. The calculation runs automatically, and only minimal user input is necessary. Different weighting models allow giving each factor more or less importance, thus making the metric flexible for different applications in development and manufacturing. The result is a final score for each recipe. A list of inspection recipes can be sorted by scores to show that recipe needs optimization. Several examples show the use of the quality metric in IBM´s East Fishkill development facility.
Keywords
inspection; quality management; semiconductor device manufacture; defect count per wafer; defect inspection recipes; inspection time; interest rate defect; nonvisual rate; quality metric; weighting model; Adders; Inspection; Manufacturing; Measurement; Monitoring; Optimization; Semiconductor device modeling; Brightfield inspection; defect inspection; defect of interest; nonvisual; quality; recipe;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2012.2202927
Filename
6212371
Link To Document