• DocumentCode
    15927
  • Title

    A Quality Metric for Defect Inspection Recipes

  • Author

    Buengener, R. ; Lee, J.L. ; Trapp, B.M. ; Rudy, J.A.

  • Author_Institution
    GLOBALFOUNDRIES, Hopewell Junction, NY, USA
  • Volume
    26
  • Issue
    1
  • fYear
    2013
  • fDate
    Feb. 2013
  • Firstpage
    3
  • Lastpage
    10
  • Abstract
    This paper describes a metric that measures the quality of defect inspection recipes. It takes into account several factors including nonvisual rate, defect of interest rate, defect count per wafer, and inspection time. The calculation runs automatically, and only minimal user input is necessary. Different weighting models allow giving each factor more or less importance, thus making the metric flexible for different applications in development and manufacturing. The result is a final score for each recipe. A list of inspection recipes can be sorted by scores to show that recipe needs optimization. Several examples show the use of the quality metric in IBM´s East Fishkill development facility.
  • Keywords
    inspection; quality management; semiconductor device manufacture; defect count per wafer; defect inspection recipes; inspection time; interest rate defect; nonvisual rate; quality metric; weighting model; Adders; Inspection; Manufacturing; Measurement; Monitoring; Optimization; Semiconductor device modeling; Brightfield inspection; defect inspection; defect of interest; nonvisual; quality; recipe;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2012.2202927
  • Filename
    6212371