• DocumentCode
    1592914
  • Title

    Tunable pattern structures in dielectric liquids under high DC electric fields

  • Author

    Espin, M.J. ; Delgado, A.V. ; Ahualli, S.

  • Author_Institution
    Dept. of Appl. Phys., Granada Univ., Spain
  • fYear
    2005
  • Firstpage
    53
  • Lastpage
    56
  • Abstract
    This work focuses on the abrupt changes that the application of large enough electric fields provokes in the internal structure of hematite/silicone oil suspensions. Experimental results reflect the existence of two well-defined structural patterns according to the strength of the field and the concentration of particles. At low electric fields, columns of particles between the electrodes can be observed when the concentration of solids exceeds a critical volume fraction. However, at higher fields, electrohydrodynamic convection and eventually electrophoretic migration take place, reflecting the relevance of the particle charge. A complete theoretical discussion is given to explain the origin of these so different behaviors. While the mismatch in the electrical properties (particularly, conductivity) of the solid and liquid phases, that is the Maxwell-Wagner polarization, can justify the chain-like structures of particles, it is necessary to take into an account the process of charge injection at the electrode/suspension interface to support the electrophoretic migration and deposition.
  • Keywords
    charge injection; dielectric liquids; electrical conductivity; electrohydrodynamics; electrophoresis; liquid structure; suspensions; Maxwell-Wagner polarization; charge injection; conductivity; dielectric liquids; electrical properties; electrohydrodynamic convection; electrophoretic migration; hematite; high DC electric fields; silicone oil; suspensions; tunable pattern structures; Conductivity; Dielectric liquids; Electrodes; Frequency; Impedance; Iron; Petroleum; Physics; Powders; Suspensions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Dielectric Liquids, 2005. ICDL 2005. 2005 IEEE International Conference on
  • Print_ISBN
    0-7803-8954-9
  • Type

    conf

  • DOI
    10.1109/ICDL.2005.1490025
  • Filename
    1490025