Surface mount technology based on a new aramid/epoxy laminate

Author

Tsunashima, Eiichi ; Okuno, Atsushi

Author_Institution

Matsushita Electron. Corp., Kyoto, Japan

fYear

1988

Firstpage

117

Lastpage

121

Abstract

The concept of an organic hybrid circuit has been realized with high reliability on the both-sides copper-foil clad and the through-hole plated board, which has a combination of aramid-paper and epoxy resin. It has resulted in a small thermal-expansion value comparable to that of ceramics below its T/sub g/, and the level of ionic contamination has been reduced to the degree adaptable for a reliable semiconductor-chip on board.<>

Keywords

composite insulating materials; hybrid integrated circuits; laminates; materials testing; organic insulating materials; printed circuits; surface mount technology; thermal expansion measurement; PTH boards; SMT; aramid-paper; aramid/epoxy laminate; epoxy resin; high reliability; level of ionic contamination; organic hybrid circuit; plated through hole board; reliable semiconductor-chip on board; surface mount technology; thermal expansion coefficient; through-hole plated board; two sided Cu foil clad board; Circuits; Costs; Electrodes; Glass; Laminates; Resins; Stability; Surface-mount technology; Thermal expansion; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International

Conference_Location

Lake Buena Vista, FL, USA

Type

conf

DOI

10.1109/EMTS.1988.16162

Filename

16162