DocumentCode :
1599045
Title :
A New Model Based on Improved ACA and BP to Predict Silicon Content in Hot Metal
Author :
Wang, Li ; Wang, Dong-qing ; Zhu, Jia-jun ; Zhao, Xiang
Author_Institution :
Key Lab. for Adv. Control of Iron & Steel Process (Minist. of Educ.), Univ. of Sci. & Technol. Beijing, Beijing, China
Volume :
1
fYear :
2010
Firstpage :
364
Lastpage :
368
Abstract :
A new model based on improved ant colony algorithm (ACA) and backpropagation (BP) is proposed to predict Silicon content of hot metal in blast furnace. BP algorithm has been widely used in training artificial neural network (ANN), which is an outstanding model to predict Silicon content. BP algorithm has many attractive features, such as adaptive learning, self- organism, and fault tolerant ability. All of them make BP one of the most successful algorithms in various fields. But BP suffers from relatively slow convergence speed, extensive computations and possible divergence for certain conditions. As a new bionic algorithm, the improved ACA has gained very good performance in solving traveling salesman problem (TSP) and other optimization problems. Its properties such as distributed computation, heuristic searching and robustness have well conquered the long convergence speed and premature problem, which are the main deficiencies of BP algorithm. Experiments show the model proposed has good performance in predicting Silicon content of hot metal.
Keywords :
backpropagation; blast furnaces; metallurgical industries; metals; silicon; travelling salesman problems; ant colony algorithm; artificial neural network training; backpropagation; blast furnace; hot metal; optimization; silicon content prediction; traveling salesman problem; Artificial neural networks; Backpropagation algorithms; Blast furnaces; Convergence; Distributed computing; Fault tolerance; Organisms; Predictive models; Silicon; Traveling salesman problems; ACA; BP; Silicon content prediction; component;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Modeling and Simulation, 2010. ICCMS '10. Second International Conference on
Conference_Location :
Sanya, Hainan
Print_ISBN :
978-1-4244-5642-0
Electronic_ISBN :
978-1-4244-5643-7
Type :
conf
DOI :
10.1109/ICCMS.2010.83
Filename :
5421367
Link To Document :
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