DocumentCode :
160068
Title :
Spray coating of self-aligning passivation layer for metal grid lines
Author :
Vuorinen, T. ; Janka, M. ; Rubingh, J.E. ; Tuukkanen, S. ; Groen, P. ; Lupo, D.
Author_Institution :
Dept. of Electron. & Commun. Eng., Tampere Univ. of Technol., Tampere, Finland
fYear :
2014
fDate :
16-18 Sept. 2014
Firstpage :
1
Lastpage :
3
Abstract :
In applications such as organic light emitting diodes (OLEDs) or photovoltaic cells a homogenous voltage distribution in the large anode layer needs to be ensured by including a metal grid with a transparent conductor layer. To ensure sufficient conductivity, relatively thick metal lines are used, which increases the risk of electrical shorts between the anode and the cathode. For this reason an insulating layer is needed on top of the metal lines. The thick metal lines limit the choice of deposition method, since some methods such as spin coating require smooth surfaces and cannot be used for applying the insulator. Here, a spray coating process has been studied as a potential alternative deposition method to create thin resistive layers on rough surfaces. Spray coating and Joule heating has been used for the alignment of insulator films on printed metal lines. It was demonstrated that spray coating can be used to cover the printed metal lines which have high peaks on them. The spray coating forms electrically insulating layers even though the film thickness is less than the height of the peaks. The leakage current through the dielectric was on the order of 10-6 A/cm2.
Keywords :
leakage currents; organic light emitting diodes; passivation; photovoltaic cells; spray coating techniques; Joule heating; OLED; film thickness; leakage current; metal grid lines; organic light emitting diodes; photovoltaic cells; self-aligning passivation layer; spray coating; Coatings; Dielectrics; Insulators; Silver; Substrates; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics System-Integration Technology Conference (ESTC), 2014
Conference_Location :
Helsinki
Type :
conf
DOI :
10.1109/ESTC.2014.6962776
Filename :
6962776
Link To Document :
بازگشت