DocumentCode :
1600786
Title :
Dielectric properties of polypropylene containing synthetic and natural organoclays
Author :
Bulinski, A. ; Bamji, S.S. ; Abou-Dakka, M. ; Chen, Y.
Author_Institution :
Inst. for Nat. Meas. Stand., Nat. Res. Council of Canada, Ottawa, ON, Canada
fYear :
2010
Firstpage :
1
Lastpage :
5
Abstract :
Fully synthetic tetrasilisic mica from Topy Co., Ltd. and Cloisite® powder of Wyoming natural montmorillonite clay from Southern Clay Products were used to manufacture polypropylene-based nanocomposites with organoclay concentrations up to 8%-wt. Both types of nano-filler increase the AC breakdown strength by approx. 10% over the unfilled material. However, the resistance to partial discharges is significantly improved, with both nano-fillers yielding similar results. Nano-fillers increase dielectric losses of PP over broad frequency and temperature ranges. Specimens containing natural clay show higher losses than the specimens containing synthetic clay, especially at higher frequencies and temperatures.
Keywords :
clay; composite insulating materials; electric breakdown; filled polymers; mica; nanocomposites; organic-inorganic hybrid materials; AC breakdown strength; Al2O3-K2O-SiO2; dielectric property; nano filler; natural montmorillonite clay; polypropylene based nanocomposites; polypropylene containing organoclay; synthetic tetrasilisic mica; Dielectric materials; Dielectrics and electrical insulation; Electric breakdown; Frequency; Manufacturing; Mechanical factors; Nanocomposites; Partial discharges; Temperature; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation (ISEI), Conference Record of the 2010 IEEE International Symposium on
Conference_Location :
San Diego, CA
ISSN :
1089-084X
Print_ISBN :
978-1-4244-6298-8
Type :
conf
DOI :
10.1109/ELINSL.2010.5549836
Filename :
5549836
Link To Document :
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