Dielectric properties of polypropylene containing synthetic and natural organoclays

Author

Bulinski, A. ; Bamji, S.S. ; Abou-Dakka, M. ; Chen, Y.

Author_Institution

Inst. for Nat. Meas. Stand., Nat. Res. Council of Canada, Ottawa, ON, Canada

fYear

2010

Firstpage

1

Lastpage

5

Abstract

Fully synthetic tetrasilisic mica from Topy Co., Ltd. and Cloisite^® powder of Wyoming natural montmorillonite clay from Southern Clay Products were used to manufacture polypropylene-based nanocomposites with organoclay concentrations up to 8%-wt. Both types of nano-filler increase the AC breakdown strength by approx. 10% over the unfilled material. However, the resistance to partial discharges is significantly improved, with both nano-fillers yielding similar results. Nano-fillers increase dielectric losses of PP over broad frequency and temperature ranges. Specimens containing natural clay show higher losses than the specimens containing synthetic clay, especially at higher frequencies and temperatures.

Keywords

clay; composite insulating materials; electric breakdown; filled polymers; mica; nanocomposites; organic-inorganic hybrid materials; AC breakdown strength; Al₂O₃-K₂O-SiO₂; dielectric property; nano filler; natural montmorillonite clay; polypropylene based nanocomposites; polypropylene containing organoclay; synthetic tetrasilisic mica; Dielectric materials; Dielectrics and electrical insulation; Electric breakdown; Frequency; Manufacturing; Mechanical factors; Nanocomposites; Partial discharges; Temperature; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation (ISEI), Conference Record of the 2010 IEEE International Symposium on

Conference_Location

San Diego, CA

ISSN

1089-084X

Print_ISBN

978-1-4244-6298-8

Type

conf

DOI

10.1109/ELINSL.2010.5549836

Filename

5549836