Title :
Cooling of electronic assemblies through PCM containing coatings
Author :
Novikov, A. ; Lexow, D. ; Nowottnick, M.
Author_Institution :
Inst. of Electron. Appliances & Circuits, Univ. of Rostock, Rostock, Germany
Abstract :
A novel concept of using phase change materials (PCM) to improve the thermal management of electronic components was investigated. The main idea is the smoothing of temperature peaks produced by the component itself or by high ambient temperature. This was realized by heat absorption during melting process of the PCM. Such materials can be used in powder form as additive to the standard coating material like resin or will be applied directly on the electronic component and encapsulated by a polymer material.
Keywords :
adsorption; assembling; coating techniques; melting; phase change materials; PCM; electronic assemblies; electronic components; heat absorption; melting process; phase change materials; polymer material; powder form; resin; standard coating material; temperature peaks; thermal management; Coatings; Cooling; Heating; Phase change materials; Resins; Temperature measurement;
Conference_Titel :
Electronics System-Integration Technology Conference (ESTC), 2014
Conference_Location :
Helsinki
DOI :
10.1109/ESTC.2014.6962787
