Benefits of reversing the circuit manufacturing and assembly processes for electronic products

This paper presents concepts for assembling electronic products without solder by building circuit layers directly atop the components, obviating the need for solder and its many associated problems. Interconnects are made by copper plating directly to the component terminations. The potential mechanical, electrical, and high-frequency performance benefits are numerous. The paper will investigate the topic and look at some of the advantages and risks of electronic assembly both with solder and without.