Reliability analysis of electronic assemblies using electrically conductive adhesive for high-reliability and Harsh environment applications

Author

Lecavelier des Etangs-Levallois, Aurelien ; Grivon, A. ; Baudet, D. ; Maia, W.C. ; Brizoux, M.

Author_Institution

Thales Corp. Eng., Meudon-la-Forêt, France

fYear

2014

fDate

16-18 Sept. 2014

Firstpage

1

Lastpage

5

Abstract

An alternative to lead-free soldering may be Electrically Conductive Adhesives (ECA) that feature lower soldering temperature. However, long-term electrical properties stability and reliability in harsh environment shall be studied. The work presented here is a comprehensive study of ECA second level interconnects characterization under thermal and thermo-mechanical stress for different PCB and component finishing.

Keywords

assembling; conductive adhesives; interconnections; printed circuits; reliability; thermal stresses; ECA second level interconnects characterization; PCB; component finishing; electrically conductive adhesives; electronic assemblies; harsh environment applications; high-reliability applications; long-term electrical properties stability; soldering temperature; thermal stress; thermomechanical stress; Assembly; Electrical resistance measurement; Electronics packaging; Joints; Reliability; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference (ESTC), 2014

Conference_Location

Helsinki

Type

conf

DOI

10.1109/ESTC.2014.6962846

Filename

6962846