• DocumentCode
    1602168
  • Title

    Nanoscale and device level analysis of the resistive switching phenomenon in ultra-thin high-k gate dielectrics

  • Author

    Crespo-Yepes, A. ; Martin-Martinez, J. ; Iglesias, Victor ; Rodriguez, Roberto ; Porti, M. ; Nafria, M. ; Aymerich, X. ; Lanza, Mario

  • Author_Institution
    Electron. Eng. Dept., Univ. Autonoma de Barcelona, Bellaterra, Spain
  • fYear
    2013
  • Firstpage
    281
  • Lastpage
    284
  • Abstract
    Some high-k dielectric materials show two interchangeable conductivity states (a High Resistive State, HRS, and Low Resistive State, LRS) in what is known as Resistive Switching (RS), being the basis of ReRAMs. In this work, the Resistive Switching (RS) phenomenon is studied on ultrathin Hf based high-k dielectrics at the nanoscale, by using the conductive atomic force microscopy (CAFM), and at device level. The CAFM allows analysing the local dielectric properties of the RS phenomenon. At device level, the temperature dependence of the RS-related gate currents during the HRS and LRS has been studied in MOSFETs.
  • Keywords
    atomic force microscopy; dielectric materials; high-k dielectric thin films; random-access storage; Hf; MOSFET; RS-related gate currents; ReRAM; conductive atomic force microscopy; device level analysis; high resistive state; high-k dielectric materials; interchangeable conductivity states; local dielectric properties; low resistive state; resistive switching phenomenon; temperature dependence; ultra-thin high-k gate dielectrics; Current measurement; Dielectrics; Hafnium compounds; Logic gates; Switches; Temperature measurement; Voltage measurement; Atomic Force Microscopy; BD reversibility; CMOS; MOSFET; Resistive Switching; dielectric breakdown (BD); high-k; reliability; temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices (CDE), 2013 Spanish Conference on
  • Conference_Location
    Valladolid
  • Print_ISBN
    978-1-4673-4666-5
  • Electronic_ISBN
    978-1-4673-4667-2
  • Type

    conf

  • DOI
    10.1109/CDE.2013.6481397
  • Filename
    6481397