A solder joint structure with vertically aligned carbon nanofibres as reinforcements

Author

Si Chen ; Di Jiang ; Lilei Ye ; Johan Liu

Author_Institution

Key Lab. of Adv. Display & Syst. Applic., Shanghai Univ., Shanghai, China

fYear

2014

fDate

16-18 Sept. 2014

Firstpage

1

Lastpage

6

Abstract

In this paper, a solder joint structure was developed for the electronic packaging industry. Vertically aligned carbon nanofibres (VACNFs) were grown, transferred and used at the interface between Si/Au pads and Sn-3.0Ag-0.5Cu (SAC305) alloy as reinforcements in order to increase the solder joint thermal fatigue resistance. The transfer and assembly processes related to VACNFs were optimised and developed. The thermal cycling test results show that the thermal fatigue life of VACNF/SAC305 solder joints is 40% longer than that of pure SAC305. The dye and pry analysis and scanning electron microscopy observation prove that the VACNFs can effectively delay the crack propagation near the interface and consequently prolong the solder joint thermal fatigue life.

Keywords

assembling; cracks; electronics packaging; gold; scanning electron microscopy; silicon; silver compounds; thermal stress cracking; tin compounds; Sn-Ag-Cu; VACNF-SAC305 solder joints; assembly process; crack propagation delay; dye analysis; electronic packaging industry; pry analysis; scanning electron microscopy observation; silicon-gold pad; solder joint structure; solder joint thermal fatigue resistance; thermal cycling test; thermal fatigue life; transfer process; vertically-aligned carbon nanofibres; Carbon; Fatigue; Gold; Soldering; Surface cracks; Surface morphology; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference (ESTC), 2014

Conference_Location

Helsinki

Type

conf

DOI

10.1109/ESTC.2014.6962851

Filename

6962851