Title :
Stiffness of PQFP ´gull-wing´ lead and its effect on solder joint reliability
Author :
Lau, John H. ; Harkins, C.G.
Author_Institution :
Hewlett-Packard Lab., Palo Alto, CA, USA
Abstract :
A 12*12 stiffness matrix of the gull-wing lead and solder joint in a plastic quad flat pack (PQFP) surface-mount assembly was obtained by using a three-dimensional finite-element method. Deformation of the composite structure for each imposed unit displacement (or rotation) then obtained. The whole-field stress distributions in the gull-wing and solder joint provide a better understanding of their characteristics. The results presented herein can provide guidelines for the design of PQFP gull-wing leads and solder-joint reliability.<>
Keywords :
finite element analysis; packaging; printed circuit manufacture; reliability; soldering; surface mount technology; FEA; PQFP; PQFP gull-wing leads; design guidelines; plastic quad flat pack; solder joint reliability; stiffness matrix; surface-mount assembly; three-dimensional finite-element method; whole-field stress distributions; Assembly; Electronics packaging; Finite element methods; Lead; Manufacturing; Sliding mode control; Soldering; Surface-mount technology; Thermal stresses; Transmission line matrix methods;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
Conference_Location :
Lake Buena Vista, FL, USA
DOI :
10.1109/EMTS.1988.16165
