• DocumentCode
    1604483
  • Title

    The ST25 Tokamak for rapid technological development

  • Author

    Sykes, A. ; Gryaznevich, M.P. ; Kingham, D. ; Sykes, N. ; Hammond, G. ; Apte, P. ; Bradley, C. ; Melhem, Z. ; Ball, S. ; Chapell, S.

  • Author_Institution
    Culham Sci. Centre, Tokamak Solutions UK, Abingdon, UK
  • fYear
    2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The ST25 tokamak is a new table-top tokamak, of major radius 25 cm and aspect ratio 2, and hence (marginally) a `spherical´ tokamak (ST). It was designed specifically to test out the feasibility of a fully superconducting device made entirely from High Temperature Superconductor (HTS) and hence be the first tokamak to demonstrate the practicality of this new medium. As a prerequisite a version with simple copper coils wound from cable has been assembled to establish operating conditions such as good vacuum, gas handling, wall conditioning, control and data acquisition etc. This has proved a valuable facility in its own right and rather than stripping off the copper coils to replace with cryostats, it will be retained and indeed upgraded, and a new vessel (denoted ST25HTS) is under construction, and will be equipped with HTS coils. Details are given of the existing copper-coil ST25, its upgrade, and the new superconducting tokamak ST25HTS.
  • Keywords
    Tokamak devices; high-temperature superconductors; plasma toroidal confinement; superconducting devices; HTS coils; ST25 Tokamak; ST25 copper-coil; copper coils; cryostats; data acquisition; fully superconducting device; gas handling; high temperature superconductor; rapid technological development; spherical tokamak; superconducting tokamak ST25HTS; table-top tokamak; wall conditioning; Coils; Copper; High-temperature superconductors; Radio frequency; Superconducting magnets; Tokamaks; spherical tokamak; superconductor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Fusion Engineering (SOFE), 2013 IEEE 25th Symposium on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-4799-0169-2
  • Type

    conf

  • DOI
    10.1109/SOFE.2013.6635330
  • Filename
    6635330