Title :
Power modules with IMS substrates for automotive applications
Author :
Correvon, Marc ; Nagashima, James ; Apter, Robert
Author_Institution :
Univ. of Appl. Sci., Yverdon, Switzerland
fDate :
6/24/1905 12:00:00 AM
Abstract :
Power modules are the basic building blocks of power converters. In many new automotive applications such as hybrid vehicles and 42 V systems, existing DBC modules (direct bond on copper) present some issues such as costs, difficulties of customization and others. We present a new technique of producing power modules for automotive applications using IMS (insulated metallic substrates) substrates. We describe the characteristics of the substrates, the discrete IGBT, the production process and also the performances of these modules. We show as example of application the design of an inverter designed specifically for a hybrid vehicle. The IMS based power modules can give performance similar to the DBC based modules, if they are properly designed. They offer an interesting custom solution tailored to the various needs of the automotive areas even in small quantities.
Keywords :
automobiles; insulated gate bipolar transistors; invertors; modules; power convertors; 42 V; DBC modules; IMS substrates; automotive applications; direct bond on copper; discrete IGBT; hybrid vehicles; insulated metallic substrates; inverter design; power converters; power modules; production process; Automotive applications; Bonding; Copper; Costs; Insulated gate bipolar transistors; Insulation; Inverters; Multichip modules; Production; Vehicles;
Conference_Titel :
Vehicular Technology Conference, 2002. VTC Spring 2002. IEEE 55th
Print_ISBN :
0-7803-7484-3
DOI :
10.1109/VTC.2002.1002986