DocumentCode :
1613168
Title :
Heat sink materials with tailored properties for thermal management
Author :
Neubauer, Erich ; Angerer, Paul ; Korb, Georg
Author_Institution :
Mater. Res., ARC Seibersdorf Res. GmbH
fYear :
0
Firstpage :
272
Lastpage :
277
Abstract :
This paper summarizes a part of the research work done at ARC Seibersdorf research during the past years related to the development of heat sink materials with tailored thermophysical properties. By using copper as a matrix material in combination with reinforcements with a low coefficient of thermal expansion a broad range of material properties can be achieved. The influence of processing conditions, type of the reinforcement as well as the variation of the volume content of the reinforcement allows tailoring the properties. Materials with such properties are of interest for use as a heat sink material. Of course there are problems to solve, especially if high thermally conductive reinforcements are used. These problems are addressed and possible solutions are explained
Keywords :
heat sinks; materials properties; thermal management (packaging); ARC Seibersdorf research; conductive reinforcements; heat sink materials; material properties; matrix material; tailored thermophysical properties; thermal expansion; thermal management; Composite materials; Conducting materials; Copper; Diamond-like carbon; Heat sinks; Powders; Silicon carbide; Thermal conductivity; Thermal expansion; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on
Conference_Location :
Wiener Neustadt
Print_ISBN :
0-7803-9325-2
Type :
conf
DOI :
10.1109/ISSE.2005.1491039
Filename :
1491039
Link To Document :
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