• DocumentCode
    1613403
  • Title

    Miniature differential-mode dual-band antenna module embedded with broadband balun

  • Author

    Saitou, Akira ; Ishikawa, Ryo ; Aoki, Yutaka ; Honjo, Kazuhiko

  • Author_Institution
    Univ. of Electro-Commun., Tokyo, Japan
  • fYear
    2011
  • Firstpage
    1298
  • Lastpage
    1301
  • Abstract
    A miniaturized dual-band differential-mode antenna with a broadband 1:1 balun is integrated in a 1-mm thick multi-layer PCB substrate. A broadband balun for the 2.5 GHz and 5.2 GHz dual-band, was designed and fabricated with a broadside-coupled line structure. With a proposed deembedding method, mixed-mode S-parameters of the unit balun were extracted with measured data. Simulated and measured return losses were better than 12 dB in the dual-band. With the balun, a miniaturized dual-band antenna embedded with lumped-elements was integrated. The lumped elements were also used for impedance-matching with the balun. The size is 60 % smaller than the half-wave dipole antenna. Measured return loss of the integrated antenna connected to a coaxial cable was 15.3 dB at 2.5 GHz and 24.1 dB at 5.2 GHz. Measured gain was almost omni-directional in both the bands. The maximum gain was -0.5 dBi at 2.5 GHz and 1.1 dBi at 5.2 GHz.
  • Keywords
    S-parameters; broadband antennas; coaxial cables; coupled transmission lines; impedance matching; multifrequency antennas; printed circuits; broadband balun; broadside coupled line structure; coaxial cable; deembedding method; frequency 2.5 GHz; frequency 5.2 GHz; impedance matching; loss 15.3 dB; loss 24.1 dB; lumped elements; miniaturized dual band differential mode antenna; mixed mode S-parameter; multilayer PCB substrate; size 1 mm; Antenna measurements; Broadband antennas; Dipole antennas; Dual band; Impedance matching; Substrates; 3-port measurement; balun; dual-band antenna; mixed-mode S-parameter; multi-layer PCB;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference Proceedings (APMC), 2011 Asia-Pacific
  • Conference_Location
    Melbourne, VIC
  • Print_ISBN
    978-1-4577-2034-5
  • Type

    conf

  • Filename
    6173997