Title :
Physical design and technology parameters for vertical system-in-package integration
Author :
Polityko, David Dmitry ; Guttowski, Stephan ; John, Werner ; Reichl, Herbert
Keywords :
Integrated circuit interconnections; Monolithic integrated circuits; Packaging; Propagation delay; Routing; Substrates; System-on-a-chip; Transistors; Wires; Wiring;
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on
Print_ISBN :
0-7803-9325-2
DOI :
10.1109/ISSE.2005.1491064
