DocumentCode
161633
Title
SOI technology: An opportunity for RF designers?
Author
Raskin, Jean-Pierre
Author_Institution
ICTEAM, Univ. catholique de Louvain, Louvain-la-Neuve, Belgium
fYear
2014
fDate
28-30 April 2014
Firstpage
1
Lastpage
2
Abstract
This last decade Silicon-on-Insulator (SOI) MOSFET technology has demonstrated its potentialities for high frequency commercial applications, reaching cutoff frequencies close to 500 GHz. SOI also presents the major advantage of providing high resistivity substrate capabilities, leading to substantially reduced substrate RF losses. High Resistivity SOI is commonly foreseen as a promising substrate for radio frequency integrated circuits and mixed signal applications. In this paper, based on several experimental and simulation results, the interest, limitations but also possible future improvements of the SOI MOS technology are presented.
Keywords
MOSFET; millimetre wave field effect transistors; silicon-on-insulator; RF designers; SOI MOSFET technology; high resistivity SOI; high resistivity substrate capability; mixed signal applications; radio frequency integrated circuits; reduced substrate RF losses; silicon-on-insulator; Capacitance; Conductivity; FinFETs; Radio frequency; Silicon-on-insulator; Substrates; Transmission line measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/VLSI-TSA.2014.6839644
Filename
6839644
Link To Document