• DocumentCode
    161633
  • Title

    SOI technology: An opportunity for RF designers?

  • Author

    Raskin, Jean-Pierre

  • Author_Institution
    ICTEAM, Univ. catholique de Louvain, Louvain-la-Neuve, Belgium
  • fYear
    2014
  • fDate
    28-30 April 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    This last decade Silicon-on-Insulator (SOI) MOSFET technology has demonstrated its potentialities for high frequency commercial applications, reaching cutoff frequencies close to 500 GHz. SOI also presents the major advantage of providing high resistivity substrate capabilities, leading to substantially reduced substrate RF losses. High Resistivity SOI is commonly foreseen as a promising substrate for radio frequency integrated circuits and mixed signal applications. In this paper, based on several experimental and simulation results, the interest, limitations but also possible future improvements of the SOI MOS technology are presented.
  • Keywords
    MOSFET; millimetre wave field effect transistors; silicon-on-insulator; RF designers; SOI MOSFET technology; high resistivity SOI; high resistivity substrate capability; mixed signal applications; radio frequency integrated circuits; reduced substrate RF losses; silicon-on-insulator; Capacitance; Conductivity; FinFETs; Radio frequency; Silicon-on-insulator; Substrates; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/VLSI-TSA.2014.6839644
  • Filename
    6839644