• DocumentCode
    161635
  • Title

    Design trends and test challenges in automotive electronics

  • Author

    Wang, L.-C.

  • Author_Institution
    Univ. of California, Santa Barbara, Santa Barbara, CA, USA
  • fYear
    2014
  • fDate
    28-30 April 2014
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Summary form only given. Electronics design has been driven by three major trends in recent years: going green, health & safety and connected intelligence. These three trends converge for automotive electronics design, driving the need for energy-efficient, intelligent and reliable chip products. This increases design complexity and demands for higher-quality products. Historically, test of automotive chip products has been a critical part to ensure that the quality demand is met. The recent trends present greater ever challenges for test of automotive chip products, including managing the enormous test data, dealing with new defect mechanisms, controlling the test cost while achieving the customer demand of zero defect rate. This talk discusses these challenges and two potential directions to overcome the challenges: Built-In Self Test (BIST) and data mining driven intelligent test. We will explain why BIST and test data mining are crucial for automotive electronics and how test is value-added for automotive chip products and not cost.
  • Keywords
    automotive electronics; built-in self test; data mining; electronic engineering computing; electronic products; BIST; automotive chip products; automotive electronics design; automotive electronics test; built-in self test; customer demand; data mining driven intelligent test; defect mechanisms; design complexity; energy-efficiency; enormous test data management; higher-quality products; quality demand; reliable chip products; test cost; test data mining; zero defect rate; Automotive engineering; Complexity theory; Data mining; Market research; Reliability; Safety;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/VLSI-TSA.2014.6839645
  • Filename
    6839645