DocumentCode
161635
Title
Design trends and test challenges in automotive electronics
Author
Wang, L.-C.
Author_Institution
Univ. of California, Santa Barbara, Santa Barbara, CA, USA
fYear
2014
fDate
28-30 April 2014
Firstpage
1
Lastpage
1
Abstract
Summary form only given. Electronics design has been driven by three major trends in recent years: going green, health & safety and connected intelligence. These three trends converge for automotive electronics design, driving the need for energy-efficient, intelligent and reliable chip products. This increases design complexity and demands for higher-quality products. Historically, test of automotive chip products has been a critical part to ensure that the quality demand is met. The recent trends present greater ever challenges for test of automotive chip products, including managing the enormous test data, dealing with new defect mechanisms, controlling the test cost while achieving the customer demand of zero defect rate. This talk discusses these challenges and two potential directions to overcome the challenges: Built-In Self Test (BIST) and data mining driven intelligent test. We will explain why BIST and test data mining are crucial for automotive electronics and how test is value-added for automotive chip products and not cost.
Keywords
automotive electronics; built-in self test; data mining; electronic engineering computing; electronic products; BIST; automotive chip products; automotive electronics design; automotive electronics test; built-in self test; customer demand; data mining driven intelligent test; defect mechanisms; design complexity; energy-efficiency; enormous test data management; higher-quality products; quality demand; reliable chip products; test cost; test data mining; zero defect rate; Automotive engineering; Complexity theory; Data mining; Market research; Reliability; Safety;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/VLSI-TSA.2014.6839645
Filename
6839645
Link To Document