• DocumentCode
    161646
  • Title

    Influence of fin-width lateral variations of a FinFET

  • Author

    Prawoto, Clarissa C. ; Cheralathan, M. ; Mansun Chan

  • Author_Institution
    Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
  • fYear
    2014
  • fDate
    28-30 April 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We have presented that, in terms of subthreshold operation, IOFF, SS and DIBL are improved in response to higher degree of lateral thickness non-uniformity. We have shown that the linearly varying film thickness of a FinFET introduces effects comparable to small variations in overall thickness. To address the non-uniformity, a correction factor for the overall thickness based on IOFF could be employed. Due to its non-trivial effects, this thickness variation angle should be considered as a parameter in FinFET modeling in order to capture a more accurate behavior, instead of only taking the average thickness.
  • Keywords
    MOSFET; semiconductor device models; FinFET modeling; correction factor; fin-width lateral variations; lateral thickness nonuniformity; linearly varying film thickness; nontrivial effects; subthreshold operation; thickness variation angle; Educational institutions; Electric potential; Films; FinFETs; Geometry; Logic gates; Performance evaluation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/VLSI-TSA.2014.6839651
  • Filename
    6839651