DocumentCode
161646
Title
Influence of fin-width lateral variations of a FinFET
Author
Prawoto, Clarissa C. ; Cheralathan, M. ; Mansun Chan
Author_Institution
Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
fYear
2014
fDate
28-30 April 2014
Firstpage
1
Lastpage
2
Abstract
We have presented that, in terms of subthreshold operation, IOFF, SS and DIBL are improved in response to higher degree of lateral thickness non-uniformity. We have shown that the linearly varying film thickness of a FinFET introduces effects comparable to small variations in overall thickness. To address the non-uniformity, a correction factor for the overall thickness based on IOFF could be employed. Due to its non-trivial effects, this thickness variation angle should be considered as a parameter in FinFET modeling in order to capture a more accurate behavior, instead of only taking the average thickness.
Keywords
MOSFET; semiconductor device models; FinFET modeling; correction factor; fin-width lateral variations; lateral thickness nonuniformity; linearly varying film thickness; nontrivial effects; subthreshold operation; thickness variation angle; Educational institutions; Electric potential; Films; FinFETs; Geometry; Logic gates; Performance evaluation;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/VLSI-TSA.2014.6839651
Filename
6839651
Link To Document