• DocumentCode
    161669
  • Title

    A high density Twin-Gate OTP cell in pure 28nm CMOS process

  • Author

    Woan Yun Hsiao ; Chin Yu Mei ; Wen Chao Shen ; Tzong Sheng Chang ; Yue Der Chih ; Ya-Chin King ; Chrong Jung Lin

  • Author_Institution
    Inst. of Electron. Eng., Nat. Tsing-Hua Univ., Hsinchu, Taiwan
  • fYear
    2014
  • fDate
    28-30 April 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    A high density high-k gate dielectric breakdown OTP cell with a self-aligned twin-gate isolation in pure 28nm HKMG process is demonstrated. With a merged spacer isolation formed by two tiny metal gates, the OTP cells can be well isolated with an ultra small cell size of 0.0441μm2 in pure 28nm CMOS logic process. The Twin-Gate OTP memory adopts low voltage high-k dielectric breakdown mechanism to obtain 104 times of On/Off ratio by a low program voltage of 4V in 20μs. A tiny and excellent Twin-Gate isolation with wide program and temperature margins has been successfully achieved in this OTP cell. Superior disturbs immunity and data retention further support the new logic OTP cell to be a promising solution in advanced logic NVM applications.
  • Keywords
    CMOS logic circuits; electric breakdown; high-k dielectric thin films; low-power electronics; CMOS logic process; CMOS process; HKMG process; advanced logic NVM applications; data retention; high density high-k gate dielectric breakdown OTP cell; high density twin-gate OTP cell; logic OTP cell; low voltage high-k dielectric breakdown mechanism; on-off ratio; one-time programmable memories; self-aligned twin-gate isolation; size 28 nm; spacer isolation; temperature margins; time 20 mus; tiny metal gates; twin-gate OTP memory; twin-gate isolation; voltage 4 V; Abstracts; CMOS integrated circuits; CMOS technology; Electric breakdown; Logic gates; Reliability; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/VLSI-TSA.2014.6839664
  • Filename
    6839664