Advancing foundry technology with scaling and innovations

Author

Shien-Yang Wu ; Lin, Colin Yu ; Yang, S.H. ; Liaw, J.J. ; Cheng, J.Y.

Author_Institution

R&D, Taiwan Semicond. Manuf. Co. Ltd., Hsinchu, Taiwan

fYear

2014

fDate

28-30 April 2014

Firstpage

1

Lastpage

3

Abstract

Being the dedicated IC foundry, TSMC provides a complete portfolio of technologies covering leading-edge technology, specialty technology, and 3D IC system integration technology to fulfill customer product needs in various market segments. While the leading-edge CMOS technology continues to extend Moore´s law as a driver for business growth, More-than-Moore specialty technology leverages the logic technology platform with value-added components to enable various functionalities for a wide range of applications. In this paper, the evolution of advanced CMOS technology is reviewed. Challenges in scaling transistor, SRAM and interconnect are discussed. Examples of specialty technology will also be illustrated.

Keywords

CMOS memory circuits; SRAM chips; foundries; integrated circuit interconnections; three-dimensional integrated circuits; transistors; 3D IC system integration technology; Moore law; SRAM; TSMC; business growth; customer product; dedicated IC foundry; foundry technology; interconnect; leading-edge CMOS technology; logic technology platform; more-than-Moore specialty technology; scaling transistor; value-added components; CMOS integrated circuits; FinFETs; Logic gates; Market research; Metals; SRAM cells;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on

Conference_Location

Hsinchu

Type

conf

DOI

10.1109/VLSI-TSA.2014.6839696

Filename

6839696