Title :
High performance PC architecture design
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
Exploring the advantages and disadvantages of chipset BGA packaging with routing and layout tips often proves beneficial in PC architecture design. A detailed discussion about typical high performance embedded PC design considerations, like the identification and prioritization of critical layout paths and associated layout guidelines, typically aides in the success of most high speed Pentium (R) processor designs. Following these tried and true application suggestions should help to avoid most of the common pitfalls of designing high performance embedded Pentium(R) processor systems
Keywords :
computer architecture; microcomputers; packaging; chipset BGA packaging; high performance PC architecture design; high speed embedded Pentium processor system; layout; routing; Assembly; Costs; Electronics packaging; Guidelines; Inspection; Pins; Printed circuits; Process design; Routing; Time to market;
Conference_Titel :
Wescon/97. Conference Proceedings
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-4303-4
DOI :
10.1109/WESCON.1997.632367