• DocumentCode
    16276
  • Title

    Stitch-Aware Routing for Multiple E-Beam Lithography

  • Author

    Liu, I. ; Fang, S. ; Chang, Y.

  • Author_Institution
    Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan
  • Volume
    34
  • Issue
    3
  • fYear
    2015
  • fDate
    Mar-15
  • Firstpage
    471
  • Lastpage
    482
  • Abstract
    Multiple e-beam lithography (MEBL) is one of the most promising next generation lithography technologies for high volume manufacturing, which improves the most critical issue of conventional single e-beam lithography, throughput, by simultaneously using thousands or millions of e-beams. For parallel writing in MEBL, a layout is split into stripes and patterns are cut by stripe boundaries, which are defined as stitching lines. Critical patterns cut by stitching lines could suffer from severe pattern distortion or even yield loss. Therefore, considering the positions of stitching lines and avoiding stitching line-induced bad patterns are required during layout design. In this paper, we propose the first work of stitch-aware routing framework for MEBL based on a two-pass bottom-up multilevel router. We first identify three types of stitching line-induced bad patterns which should not exist in an MEBL-friendly routing solution. Then, stitch-aware routing algorithms are, respectively, developed for global routing, layer/track assignment, and detailed routing. Experimental results show that our stitch-aware routing framework can effectively reduce stitching line-induced bad patterns and thus may not only improve the manufacturability but also facilitate the development of MEBL.
  • Keywords
    Electronic mail; Layout; Lithography; Routing; Wires; Writing; Algorithms; Design; Multiple electron beam lithography; Performance; design; manufacturability; multiple e-beam lithography (MEBL); performance; routing; stitch;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2014.2385761
  • Filename
    7008499