Title :
Liquid crystal polymer (LCP) for microwave/millimeter wave multilayer packaging
Author :
Wei, Z. ; Pham, A.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA
Abstract :
This paper presents characterization and analysis of liquid crystal polymer materials for microwave and millimeter multi-layer packaging. Processing techniques have been developed to fabricate interconnects on this new LCP material. The experimental results demonstrate that an interconnect on LCP achieves a measured insertion loss of less than 0.1 dB/mm up to 50 GHz. This material is highly suitable for microwave and millimeter wave packaging.
Keywords :
coplanar waveguides; interconnections; liquid crystal polymers; packaging; 50 GHz; coplanar waveguide transmission line; insertion loss; interconnect fabrication; liquid crystal polymer; microwave multilayer packaging; millimeter-wave multilayer packaging; Coplanar waveguides; Crystalline materials; Crystallization; Fabrication; Gold; Integrated circuit interconnections; Liquid crystal polymers; Millimeter wave measurements; Millimeter wave technology; Packaging;
Conference_Titel :
Microwave Symposium Digest, 2003 IEEE MTT-S International
Conference_Location :
Philadelphia, PA, USA
Print_ISBN :
0-7803-7695-1
DOI :
10.1109/MWSYM.2003.1210619
