DocumentCode :
1631186
Title :
New approach to investigate the dynamic relaxation process of complex peak in mechanical and dielectric characteristics of anelastic solids
Author :
Kim, Bong Heup
Author_Institution :
Dept. of Electr. Eng., Hanyang Univ., Seoul, South Korea
Volume :
1
fYear :
1997
Firstpage :
6
Abstract :
Complex dynamic relaxation processes of mechanical as well as dielectric character in polymeric anelastic solids are closely related through the movement of molecular chain segment in morphological structure, and the morphology can easily be modified by the treatments such as mechanical drawing or irradiation, those of which result, in turn, the complicated change on the appearance of the observed complex relaxation peak. In order to extract any meaningful understanding from the modified appearance of the peak, the relaxation peak must be resolved into the sum of the dynamic single relaxation peaks, each of which can be characterized respectively by three factors such as activation energy, magnitude of peak height and peak point temperature on the temperature dependent characteristics
Keywords :
anelastic relaxation; dielectric materials; dielectric relaxation; drawing (mechanical); polymers; activation energy; complex dynamic relaxation; dielectric characteristics; drawing; irradiation; mechanical characteristics; molecular chain segment; morphological structure; peak height; peak point temperature; polymeric anelastic solid; Damping; Dielectrics; Frequency; Mechanical variables measurement; Polymers; Shape; Solids; Temperature dependence; Temperature measurement; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 1997., Proceedings of the 5th International Conference on
Conference_Location :
Seoul
Print_ISBN :
0-7803-2651-2
Type :
conf
DOI :
10.1109/ICPADM.1997.617515
Filename :
617515
Link To Document :
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