A semi-distributed method for inductor de-embedding

This paper presents a de-embedding method based on pad and thru test structures for on-wafer inductor characterization. A transmission line model in combination with parallel admittances describing the pads is used to characterize the thru test structure. This method is compared to the standard “open-short”, “open-thru” and “pad-open-short” de-embedding methods and electromagnetic simulations. It is demonstrated that the proposed method is more accurate or saves chip area compared to the standard de-embedding methods.