DocumentCode
1633396
Title
Flow and warpage simulation of mobile phone injection mold
Author
Xia, Wang
Author_Institution
Sch. of Inf. Sci. & Technol., TSU, Taian, China
Volume
2
fYear
2012
Firstpage
491
Lastpage
493
Abstract
In order to improve the injection quality of mobile phone, The CAE theory of injection molding is studied and the flow and warpage simulation is undertaken based on the Moldflow software. After the filling and warpage simulation, the defects in the plastic part are fond and the injection parameter and the shell structure is improved. The results show that the tryout time is saved and the design efficiency of the injection mold is improved.
Keywords
electronics packaging; flow simulation; injection moulding; mechanical engineering computing; mobile handsets; plastic flow; production engineering computing; CAE theory; Moldflow software; flow simulation; injection quality; mobile phone injection mold; plastic part defects; warpage simulation; Filling; Mathematical model; Mobile handsets; Plastics; Software; Solid modeling; Welding; flow; injection mold; simulation; warpage;
fLanguage
English
Publisher
ieee
Conference_Titel
Instrumentation & Measurement, Sensor Network and Automation (IMSNA), 2012 International Symposium on
Conference_Location
Sanya
Print_ISBN
978-1-4673-2465-6
Type
conf
DOI
10.1109/MSNA.2012.6324629
Filename
6324629
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