DocumentCode :
1634677
Title :
Analysis of RF performances of GaN MESFETs including self-heating and trapping effects
Author :
Islam, S.S. ; Anwar, A.F.M.
Author_Institution :
Dept. of Electr. Eng., Rochester Inst. of Technol., NY, USA
Volume :
1
fYear :
2003
Firstpage :
459
Abstract :
A physics-based large-signal model of GaN-MESFETs is reported which includes temperature dependences of transport and trapping parameters. RF power performances are analyzed using generalized Volterra series techniques. At 2 GHz, the calculated maximum output power of a 0.3 /spl mu/m/spl times/100 /spl mu/m GaN MESFET is 22.8 dBm at a power gain of 6.1 dB and power added efficiency of 28.5%. The corresponding quantities are in excellent agreement with the measured values of 23 dBm, 5.8 dB and 27.5%, respectively. At 2 GHz, gain compressions, due to self-heating effects, of 2.2 dB and 0.75 dB are obtained for 0.30 /spl mu/m/spl times/100 /spl mu/m and 0.75 /spl mu/m/spl times/100 /spl mu/m GaN MESFETs, respectively. At 4 GHz and 10 dBm output power, the calculated third-order intermodulations (IM3) for 0.30 /spl mu/m/spl times/100 /spl mu/m and 0.75 /spl mu/m/spl times/100 /spl mu/m GaN MESFETs are -56 dBc and -44 dBc, respectively. For the same devices, IM3 increases by 6 dBc and 3 dBc due to self-heating effects, respectively.
Keywords :
III-V semiconductors; Volterra series; gallium compounds; intermodulation; microwave field effect transistors; power MESFET; semiconductor device models; thermal stability; wide band gap semiconductors; 0.3 micron; 0.75 micron; 100 micron; 2 GHz; 27.5 percent; 28.5 percent; 4 GHz; 5.8 dB; 6.1 dB; GaN; GaN MESFET RF performance; IM3; MESFET maximum output power gain; gain compression; generalized Volterra series techniques; power added efficiency; self-heating effects; thermal simulators; thermal stability; third-order intermodulation; transport/trapping parameter temperature dependency; trapping effects; Gallium nitride; HEMTs; Heating; MESFETs; Performance analysis; Power generation; Radio frequency; Silicon carbide; Temperature dependence; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 2003 IEEE MTT-S International
Conference_Location :
Philadelphia, PA, USA
ISSN :
0149-645X
Print_ISBN :
0-7803-7695-1
Type :
conf
DOI :
10.1109/MWSYM.2003.1210975
Filename :
1210975
Link To Document :
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