Ion implantation technology in SiC for power device applications

Silicon carbide (SiC) is a newly-emerging wide bandgap semiconductor, by which high-voltage, low-loss power devices can be realized owing to its superior properties. Because of its strong bonding energy and thermal stability, however, special cares must be paid to form high-quality junctions by ion implantation. This paper reviews present status and remaining issues of ion implantation technology in SiC. Requirements of hot implantation and high-temperature annealing are discussed in terms of electrical activation, defect generation, and junction characteristics. Furthermore, recent progress in junction termination for high-voltage SiC devices by using ion implantation is described.