• DocumentCode
    163584
  • Title

    Terahertz oscillation in GaN HEMT-like BEAN diode with a composite contact

  • Author

    Ying Wang ; Lin-An Yang ; Yue Hao

  • Author_Institution
    Sch. of Microelectron., Xidian Univ., Xidian, China
  • fYear
    2014
  • fDate
    18-20 May 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The Well-designed Schottky-ohmic anode contact is demonstrated to effectively suppress the impact ionization concentrated at the anode side in the ultra-short 2-DEG channel of the GaN HEMT-like ballistic electron acceleration (HBEAN) diode which is investigated as a potential terahertz oscillator. An empirical velocity-field characteristics is employed, which is derived from the experimental data and accounts for the presence of ballistic electron acceleration and inter-valley transfer in the GaN channel. Simulations reveal that surface donor-like traps results in the deterioration of the Gunn oscillation and the cut-down effect of the composite contact, the effect of which is greatly related to its energy level. These works are predicted to have positive significance in practice manufacture of THz electron devices.
  • Keywords
    Gunn oscillators; III-V semiconductors; anodes; gallium compounds; high electron mobility transistors; impact ionisation; semiconductor diodes; two-dimensional electron gas; wide band gap semiconductors; GaN; Gunn oscillation; HEMT-like BEAN diode; HEMT-like ballistic electron acceleration diode; Schottky-ohmic anode contact; THz electron devices; composite contact; cut-down effect; empirical velocity-field characteristics; energy level; impact ionization; inter-valley transfer; surface donor-like traps; terahertz oscillation; terahertz oscillator; ultra-short 2-DEG channel; Anodes; Electric fields; Gallium nitride; Impact ionization; Mathematical model; Oscillators; Schottky diodes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology (IWJT), 2014 International Workshop on
  • Conference_Location
    Shanghai
  • Type

    conf

  • DOI
    10.1109/IWJT.2014.6842036
  • Filename
    6842036