Title :
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP ´04) (IEEE Cat. No.04EX905)
Abstract :
The following topics are dealt with: system design and packaging; lead free technology; embedded components, substrate and system aspects; reliability and modeling; MEMS and nanointegration technology; dispensing technology and soldering; flip chip and wire bonding technology; conductive adhesive joining technology; MEMS packaging; and thermal management.
Keywords :
adhesive bonding; circuit reliability; electronics packaging; flip-chip devices; integrated circuit design; lead bonding; micromechanical devices; soldering; thermal management (packaging); MEMS packaging; conductive adhesive joining technology; dispensing technology; embedded components; flip chip technology; lead free technology; nanointegration technology; soldering; substrate; system design; system packaging; thermal management; wire bonding technology;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8620-5
DOI :
10.1109/HPD.2004.1346655
