DocumentCode
164136
Title
Demonstration of temperature compensated voltage reference integrated circuit designed with 4H-SiC MESFETs
Author
Banu, V. ; Godignon, P. ; Alexandru, M. ; Vellvehi, M. ; Jorda, X. ; Millan, J.
Author_Institution
D+T Microelectron. A.I.E., Bellaterra, Spain
fYear
2014
fDate
13-15 Oct. 2014
Firstpage
233
Lastpage
236
Abstract
This work demonstrate for the first time a functional high temperature compensated Voltage Reference integrated circuit (IC) on 4H-SiC material, built with MESFET devices. A special finger type MESFET that overcome the typical embedded drain leakage of finger type MESFET, was developed for this purpose. The schematic and the principle of the circuit is based on a new concept design that avoid the bandgap reference topology and the necessity of using an operational amplifier (OpAmp), which is not yet developed on SiC. The experimental temperature coefficient (TC) is significantly better than a Zener diode and comparable to the normal bandgap voltage references on silicon, but the present circuit has the advantage to be able to work beyond 250oC. The circuit contains also a linear temperature sensor.
Keywords
MESFET integrated circuits; compensation; energy gap; high-temperature electronics; hydrogen; integrated circuit design; reference circuits; silicon compounds; temperature sensors; 4H-SiC MESFET; bandgap voltage references; embedded drain leakage; finger type MESFET; high temperature compensated voltage reference IC; high temperature compensated voltage reference integrated circuit; linear temperature sensor; silicon; silicon carbide; temperature coefficient; Integrated circuits; MESFETs; Photonic band gap; Schottky diodes; Silicon carbide; Temperature measurement; Temperature sensors; High temperature; Integrated Circuit; MESFET; SiC; Silicon Carbide; Thermal compensated; Voltage reference;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference (CAS), 2014 International
Conference_Location
Sinaia
ISSN
1545-827X
Print_ISBN
978-1-4799-3916-9
Type
conf
DOI
10.1109/SMICND.2014.6966445
Filename
6966445
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