DocumentCode :
1641367
Title :
The relationship between ground and EMI
Author :
Peng, Zhang ; Li Shufang
Author_Institution :
Beijing Univ. of Posts & Telecommun.
Volume :
1
fYear :
2005
Firstpage :
662
Abstract :
Ground is an important concept in the PCB design. It provides return current path for both power and signal. Improperly grounding may cause EMI problem in PCB design. High impedance returns path brings the increment of EMI. Today, electronics engineers meet with the problems that the size of the PCB is getting smaller and smaller so that large area grounding has become a challenge to them. This paper focuses on the simulation of high-speed transmission line´s grounding, illustrating the EMI due to improperly grounding. And after that, some methods are promoted to reduce EMI
Keywords :
earthing; electromagnetic interference; printed circuit design; EMI; PCB design; high-speed transmission lines grounding; Circuit simulation; Electromagnetic interference; Electronics industry; Frequency; Grounding; Impedance; Inductance; Industrial electronics; Parasitic capacitance; Wire; EMI; Grounding; PCB;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 2005. MAPE 2005. IEEE International Symposium on
Conference_Location :
Beijing
Print_ISBN :
0-7803-9128-4
Type :
conf
DOI :
10.1109/MAPE.2005.1617997
Filename :
1617997
Link To Document :
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