Title :
SMT statistical process control using automatic X-ray inspection
Author_Institution :
Nicolet Instrum. Corp., Madison, WI, USA
Abstract :
A method of attaining high-quality yields in surface-mount technology (SMT) is discussed, which is to develop a system of statistical process control (SPC). One evaluable tool for implementing a system of SPC is automatic X-ray inspection because of its natural ability to recognize hidden characteristics representative of SMT process quality.<>
Keywords :
X-ray applications; inspection; printed circuit manufacture; quality control; radiography; statistical process control; surface mount technology; SMT; SPC; X-ray radiography; attaining high-quality yields; automatic X-ray inspection; hidden characteristics; solder voids detection; statistical process control; surface-mount technology; Art; Assembly; Bridge circuits; Inspection; Lead; Manufacturing industries; Manufacturing processes; Process control; Production; Surface-mount technology;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
Conference_Location :
Lake Buena Vista, FL, USA
DOI :
10.1109/EMTS.1988.16180
