Title :
Wideband Spice-compatible modeling of packages
Author :
Schmidt-Szalowski, M.
Author_Institution :
Bus. Line RF Small Signal, NXP Semicond., Nijmegen, Netherlands
Abstract :
An extraction method for automated generation of lumped-circuit models of multiport low-loss broadband devices is presented. The method takes a table of S-parameters of the modeled device as the input and translates it to a Spice-compatible netlist. This method differs from the existing ones in making a tight link to the physical properties of the modeled device observing and yet remaining versatile and highly automated. The extraction of the model parameters is based on the hybrid matrix because of its good numerical properties including the DC point. The RLC models incorporate all the major parasitic effects, including capacitive and inductive coupling, distributed effects, skin effect and dielectric relaxation.
Keywords :
RLC circuits; S-parameters; SPICE; integrated circuit modelling; integrated circuit packaging; multiport networks; RLC models; S-parameters; Spice compatible netlist; capacitive coupling; dielectric relaxation; electronics packaging; inductive coupling; lumped circuit models; multiport low-loss broadband devices; skin effect; wideband Spice compatible modeling; Analytical models; Fitting; Integrated circuit modeling; Mathematical model; Numerical models; Ports (Computers); Scattering parameters; IC packages; Spice-compatible models;
Conference_Titel :
Microwave Integrated Circuits Conference (EuMIC), 2012 7th European
Conference_Location :
Amsterdam
Print_ISBN :
978-1-4673-2302-4
Electronic_ISBN :
978-2-87487-026-2