Title :
Microsystem manufacturing, assembly and packaging technology in Display-Card™ applications
Author :
Duan, Junmei ; Asplund, Johan ; Liu, Johan
Author_Institution :
Iprobe, Sweden
Abstract :
The SWECARD Display-Card™ has the same dimensions as a standard credit card, yet also features a display and buttons that make it possible to view stored information. The applications are endless: airline tickets, bankcards, loyalty cards, health cards and security/ID cards. Because of the size of the card, the microsystems manufacturing, assembly and packaging technology is extremely important to ensure a successful mass production. During the development of the cards and two small-scale productions, we encountered problems such as short circuit, misalignment, leakage, etc. However, these proved to be solvable with adjustments in our technology. This paper will address all the issues in this area and shed light on new ideas in the future R&D work.
Keywords :
assembling; micromechanical devices; packaging; smart cards; Display-Card™ applications; SWECARD Display-Card™; airline tickets; assembly; bankcards; health cards; information storage; loyalty cards; microsystem manufacturing; packaging technology; security/ID cards; short circuit; standard credit card; Assembly; Batteries; Conductive films; Flexible printed circuits; Liquid crystal displays; Manufacturing; Packaging; Positron emission tomography; Substrates; Switches;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN :
0-7803-8620-5
DOI :
10.1109/HPD.2004.1346713