On-chip interconnect evaluation on delay time increase by crosstalk

This paper describes on-chip interconnect evaluation on the delay time increase by crosstalk. The new test configurations were applied to evaluate the impact of low-k materials and improved circuit techniques on the delay time increase by crosstalk. It is found that the reduction of Cl for low-k materials, organic and air gap, is effective in reducing the delay time increase by crosstalk. Also, it is experimentally verified that improved circuit techniques such as repeaters and variable pitch routers significantly reduce not only interconnect delay but also delay time increase by crosstalk.