• DocumentCode
    1644812
  • Title

    Design and analysis of integrated Built-in-Sensors for wireless reconfigurable applications

  • Author

    Elkassir, B. ; Wane, S.

  • Author_Institution
    NXP-Semicond., Colombelles Caen, France
  • fYear
    2012
  • Firstpage
    496
  • Lastpage
    499
  • Abstract
    In this paper design, analysis and fabrication of On-Chip Built-in-Sensors for wireless reconfigurable applications are presented. Feasibility of On-Chip Built-in-Sensors is investigated through realization of scalable LNA gain. The scalability of the LNA gain is digitally controlled by attenuators (implemented using two options: MOS and Bipolar switches). Novel automatic oscillation amplitude control of VCO-PLL systems implemented as Built-in-Self-Sensor is proposed. The Built-in-Sensor circuits are realized using NXP SiGe:C technology and characterized based on careful correlation between predicted simulation results and experimental verifications.
  • Keywords
    Ge-Si alloys; MIS devices; carbon; detector circuits; integrated circuit design; low noise amplifiers; phase locked loops; sensors; switches; voltage-controlled oscillators; MOS switch; SiGe:C; VCO-PLL systems; automatic oscillation amplitude control; bipolar switch; integrated built-in sensor; scalable LNA gain; wireless reconfigurable applications; Built-in self-test; Oscillators; Phase locked loops; Radio frequency; Temperature measurement; Temperature sensors; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Integrated Circuits Conference (EuMIC), 2012 7th European
  • Conference_Location
    Amsterdam
  • Print_ISBN
    978-1-4673-2302-4
  • Electronic_ISBN
    978-2-87487-026-2
  • Type

    conf

  • Filename
    6483845