DocumentCode
1644812
Title
Design and analysis of integrated Built-in-Sensors for wireless reconfigurable applications
Author
Elkassir, B. ; Wane, S.
Author_Institution
NXP-Semicond., Colombelles Caen, France
fYear
2012
Firstpage
496
Lastpage
499
Abstract
In this paper design, analysis and fabrication of On-Chip Built-in-Sensors for wireless reconfigurable applications are presented. Feasibility of On-Chip Built-in-Sensors is investigated through realization of scalable LNA gain. The scalability of the LNA gain is digitally controlled by attenuators (implemented using two options: MOS and Bipolar switches). Novel automatic oscillation amplitude control of VCO-PLL systems implemented as Built-in-Self-Sensor is proposed. The Built-in-Sensor circuits are realized using NXP SiGe:C technology and characterized based on careful correlation between predicted simulation results and experimental verifications.
Keywords
Ge-Si alloys; MIS devices; carbon; detector circuits; integrated circuit design; low noise amplifiers; phase locked loops; sensors; switches; voltage-controlled oscillators; MOS switch; SiGe:C; VCO-PLL systems; automatic oscillation amplitude control; bipolar switch; integrated built-in sensor; scalable LNA gain; wireless reconfigurable applications; Built-in self-test; Oscillators; Phase locked loops; Radio frequency; Temperature measurement; Temperature sensors; Wireless sensor networks;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Integrated Circuits Conference (EuMIC), 2012 7th European
Conference_Location
Amsterdam
Print_ISBN
978-1-4673-2302-4
Electronic_ISBN
978-2-87487-026-2
Type
conf
Filename
6483845
Link To Document