DocumentCode
1645673
Title
Signal Integrity verification of Coplanar Structures for shielded on-chip interconnect lines
Author
Khan, Zafar Bedar ; Kim, Hyewon ; Eo, Yungseon
Author_Institution
Dept. of Electr. & Comput. Eng., Hanyang Univ., Ansan, South Korea
fYear
2009
Firstpage
440
Lastpage
443
Abstract
This paper analyses and compares two coplanar structures to be employed as shielded structures for on-chip critical interconnect lines such as clock. It is believed that at lower bit rates, on-chip area overhead caused by the ground-signal-ground structure can be mitigated by a coplanar power-signal-ground structure, if the performance of the two is not much different. However at higher bit rates, in addition to area saving, the later structure is shown to be better performance wise.
Keywords
clocks; coplanar waveguides; integrated circuit interconnections; clock; coplanar structures; on-chip area overhead; shielded on-chip interconnect lines; shielded structures; signal integrity verification; Bit rate; Clocks; Conductivity; Coplanar transmission lines; Coplanar waveguides; Copper; Frequency; Integrated circuit interconnections; Parameter extraction; Power transmission lines; Coplanar Waveguide; Signal Integrity; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
SoC Design Conference (ISOCC), 2009 International
Conference_Location
Busan
Print_ISBN
978-1-4244-5034-3
Electronic_ISBN
978-1-4244-5035-0
Type
conf
DOI
10.1109/SOCDC.2009.5423861
Filename
5423861
Link To Document