• DocumentCode
    164639
  • Title

    Impressum

  • fYear
    2014
  • fDate
    23-26 Oct. 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Provides a listing of current committee members and society officers.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for
  • Conference_Location
    Bucharest
  • Type

    conf

  • DOI
    10.1109/SIITME.2014.6966984
  • Filename
    6966984
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=164639