• DocumentCode
    164647
  • Title

    Nanofluids for electronics cooling

  • Author

    Turgut, Alpaslan ; Elbasan, Emre

  • Author_Institution
    Dept. of Mech. Eng., Dokuz Eylul Univ., Izmir, Turkey
  • fYear
    2014
  • fDate
    23-26 Oct. 2014
  • Firstpage
    35
  • Lastpage
    37
  • Abstract
    The goal of this study is to investigate experimentally the thermal performance of an electronics cooling system which is available in the market. Selected system is a water block used for liquid cooling of a central processing unit (CPU) of a computer. A suitable heater (resistance wire) is fabricated for producing heat similar to CPU. System is instrumented with K-type thermocouples for the temperature measurement of certain points. The experiments were carried out first with water and then with water-based Alumina nanofluid. Nanofluid sample was supplied from NanoAmor Inc., with particle concentration of 6.33 volumetric percent and diluted to 1 volumetric percent with water, by using a probe type ultrasound for 2 minutes at 70 W. During the experiments 60 W power applied to the CPU and the ambient temperature was 19 degree Celcius. Our results show that nanofluids, with low volume concentration (1 percent vol.) of Alumina particles decreases the maximum temperature of the system, almost 2.7 degree Celcius, compared to water.
  • Keywords
    cooling; nanofluidics; temperature measurement; thermal management (packaging); thermocouples; CPU; K-type thermocouples; central processing unit; electronics cooling; power 60 W; power 70 W; temperature measurement; thermal performance; time 2 min; water-based alumina nanofluid; Aluminum oxide; Central Processing Unit; Cooling; Electronics cooling; Fluids; Nanofluidics; Temperature measurement; central processing unit (CPU); electronics cooling; nanofluids; nanoparticles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for
  • Conference_Location
    Bucharest
  • Type

    conf

  • DOI
    10.1109/SIITME.2014.6966989
  • Filename
    6966989