DocumentCode
164647
Title
Nanofluids for electronics cooling
Author
Turgut, Alpaslan ; Elbasan, Emre
Author_Institution
Dept. of Mech. Eng., Dokuz Eylul Univ., Izmir, Turkey
fYear
2014
fDate
23-26 Oct. 2014
Firstpage
35
Lastpage
37
Abstract
The goal of this study is to investigate experimentally the thermal performance of an electronics cooling system which is available in the market. Selected system is a water block used for liquid cooling of a central processing unit (CPU) of a computer. A suitable heater (resistance wire) is fabricated for producing heat similar to CPU. System is instrumented with K-type thermocouples for the temperature measurement of certain points. The experiments were carried out first with water and then with water-based Alumina nanofluid. Nanofluid sample was supplied from NanoAmor Inc., with particle concentration of 6.33 volumetric percent and diluted to 1 volumetric percent with water, by using a probe type ultrasound for 2 minutes at 70 W. During the experiments 60 W power applied to the CPU and the ambient temperature was 19 degree Celcius. Our results show that nanofluids, with low volume concentration (1 percent vol.) of Alumina particles decreases the maximum temperature of the system, almost 2.7 degree Celcius, compared to water.
Keywords
cooling; nanofluidics; temperature measurement; thermal management (packaging); thermocouples; CPU; K-type thermocouples; central processing unit; electronics cooling; power 60 W; power 70 W; temperature measurement; thermal performance; time 2 min; water-based alumina nanofluid; Aluminum oxide; Central Processing Unit; Cooling; Electronics cooling; Fluids; Nanofluidics; Temperature measurement; central processing unit (CPU); electronics cooling; nanofluids; nanoparticles;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for
Conference_Location
Bucharest
Type
conf
DOI
10.1109/SIITME.2014.6966989
Filename
6966989
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