Flow simulations for ccomponent spacing optimization on PCB boards

Author

Alexandra, Fodor ; Rajmond, Jano ; Dan, Pantis

Author_Institution

Appl. Electron. Dept., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania

fYear

2014

fDate

23-26 Oct. 2014

Firstpage

149

Lastpage

152

Abstract

The paper focuses on analyzing component placement on a PCB board. The study was done with SolidWorks simulations to analize the air flow on the surface of a PCB, equipped with two components, heated at 40 Celsius degrees. The spacing between components and their position were varied, in order to see what the optimal configuration for better cooling the assembly is. The first set of simulations were comprised of a set of generic components, modeled with cubic shapes, and were replaced with DPACK components, a package that is most used for electronic components that generate large quantities of energy. Test results show that the distance between components has a significant impact on cooling capabilities, in case an air flow exists.

Keywords

cooling; optimisation; printed circuit manufacture; thermal management (packaging); DPACK components; PCB boards; SolidWorks simulations; air flow; component placement; component spacing optimization; cooling; electronic components; flow simulations; temperature 40 C; Aerodynamics; Atmospheric modeling; Computational fluid dynamics; Cooling; Heating; Mathematical model; Shape; CFD; Solidworks; air flow; thermal modelling;

fLanguage

English

Publisher

ieee

Conference_Titel

Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for

Conference_Location

Bucharest

Type

conf

DOI

10.1109/SIITME.2014.6967015

Filename

6967015