DocumentCode :
1649950
Title :
Practical Variation-Aware Interconnect Delay and Slew Analysis for Statistical Timing Verification
Author :
Xiaoji Ye ; Peng Li ; Liu, F.
Author_Institution :
Dept. of ECE, Texas A&M Univ., College Station, TX
fYear :
2006
Firstpage :
54
Lastpage :
59
Abstract :
Interconnects constitute a dominant source of circuit delay for modern chip designs. The variations of critical dimensions in modern VLSI technologies lead to variability in interconnect performance that must be fully accounted for in timing verification. However, handling a multitude of inter-die/intra-die variations and assessing their impacts on circuit performance can dramatically complicate the timing analysis. In this paper, a practical interconnect delay and slew analysis technique is presented to facilitate efficient evaluation of wire performance variability. By harnessing a collection of computationally efficient procedures and closed-form formulas, process and input signal variations are directly mapped into the variability of the output delay and slew. Since our approach produces delay and slew expressions parameterized in the underlying process variations, it can be harnessed to enable statistical timing analysis while considering important statistical correlations. Our experimental results have indicated that the presented analysis is accurate regardless of location of sink nodes and it is also robust over a wide range of process variations
Keywords :
delay circuits; statistical analysis; timing circuits; circuit delay; closed-form formula; process variation; signal variation; slew analysis; statistical correlation; statistical timing analysis; statistical timing verification; variation-aware interconnect delay; wire performance variability; Chip scale packaging; Circuit optimization; Delay; Integrated circuit interconnections; Performance analysis; Robustness; Signal processing; Timing; Very large scale integration; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer-Aided Design, 2006. ICCAD '06. IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
ISSN :
1092-3152
Print_ISBN :
1-59593-389-1
Type :
conf
DOI :
10.1109/ICCAD.2006.320133
Filename :
4110153
Link To Document :
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