DocumentCode :
1652118
Title :
Physical Aware Frequency Selection for Dynamic Thermal Management in Multi-Core Systems
Author :
Mukherjee, Rajarshi ; Memik, Seda Ogrenci
Author_Institution :
Synopsys, Inc., Mountain View, CA
fYear :
2006
Firstpage :
547
Lastpage :
552
Abstract :
In order to maintain performance per watt in microprocessors, there is a shift towards the chip level multiprocessing paradigm. Microprocessor manufacturers are experimenting with tens of cores, forecasting the arrival of hundreds of cores per single processor die in the near future. With such large-scale integration and increasing power densities, thermal management continues to be a significant design effort to maintain performance and reliability in modern process technologies. In this paper, we present two mechanisms to perform frequency scaling as part of dynamic frequency and voltage scaling (DVFS) to assist dynamic thermal management (DTM). Our frequency selection algorithms incorporate the physical interaction of the cores on a large-scale system onto the emergency intervention mechanisms for temperature reduction of the hotspot, while aiming to minimize the performance impact of frequency scaling on the core that is in thermal emergency. Our results show that our algorithm consistently succeeds in maximizing the operating frequency of the most critical core while successfully relieving the thermal emergency of the core. A comparison of our two alternative techniques reveals that our physical aware criticality-based algorithm results in 11.7% faster clock frequencies compared to our aggressive scaling algorithm. We also show that our technique is extremely fast and is suited for real time thermal management
Keywords :
frequency response; microprocessor chips; power aware computing; power system management; system-on-chip; chip level multiprocessing; criticality-based algorithm; dynamic frequency; dynamic thermal management; emergency intervention; frequency scaling; frequency selection; large-scale system; microprocessors; multicore systems; temperature reduction; thermal emergency; voltage scaling; Disaster management; Energy management; Frequency; Large scale integration; Maintenance; Manufacturing processes; Microprocessors; Power system reliability; Technology management; Thermal management; Dynamic Thermal Management; Multi-Core System;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer-Aided Design, 2006. ICCAD '06. IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
ISSN :
1092-3152
Print_ISBN :
1-59593-389-1
Electronic_ISBN :
1092-3152
Type :
conf
DOI :
10.1109/ICCAD.2006.320172
Filename :
4110229
Link To Document :
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