1654213

Stress migration related reliability concerns

Ma, Jenny J Y ; Tseng, Summer F C ; Chien, Kary W T ; Ruan, Vivi W W

Reliability Eng. Div., Semicond. Manuf. Int. Corp., Shanghai, China

2005

690

691

curing; failure analysis; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; plasma materials processing; thermal stresses; tungsten; voids (solid); CMP; EKC; IC interconnect reliability; ILD film thickness; UV cure conditions; W; WLRC; ash recipe; failure analyses; galvanic effects; interlayer dielectrics; plasma ashing; plug voids; self-heated SM test pattern structure; stress migration; via chain test structures; via missing tungsten; wafer level temperature cycling; Automatic testing; Dielectrics; Etching; Failure analysis; Plasma applications; Plugs; Probes; Samarium; Solvents; Stress;

English

ieee

Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International

0-7803-8803-8

conf

10.1109/RELPHY.2005.1493207

1493207